- High-Voltage and Automotive Circuit Design

August 30 – September 2, 2016                                   Deadline for registration: July 13, 2016registration

TUESDAY, August 30

8:30-10:00 am Introduction : HV/High-Temperature Challenges Herman Casier
10:30-12:00 am High-Voltage/High-Temperature Limitations Herman Casier
1:30-5:00 pm ESD Protection in Hign-Voltage Design Tim Schmerbeck

WEDNESDAY, August 31

8:30-10:00 am High-Voltage/High-Temperature Limitations Herman Casier
10:30-12:00 am Environment Interferences Herman Casier
1:30-3:00 pm Power Switches Bernhard Wicht
3:30-5:00 pm Gate Drivers and Protection Bernhard Wicht

THURSDAY, September 1

8:30-10:00 am Linear Regulators and Charge Pumps Bernhard Wicht
10:30-12:00 am Switched Mode Power Supplies Bernhard Wicht
1:30-5:00 pm Circuit Design for EMC Michiel Steyaert

FRIDAY, September 2

8:30-10:00 am Functional Safety According to ISO26262 in IC
Development
Dirk Hammerschmidt
10:30-12:00 am
& 1:30-3:00 pm
Automotive Sensors Dirk Hammerschmidt
registration

Abstracts

High-Voltage and Automotive Circuit Design
August 30 – September 2, 2016
EPFL Premises, Lausanne, Switzerland

Introduction : High-Voltage/High Temperature Challenges and Limitations
Herman Casier, Consultant

Although most electronic systems and circuits are used in rather well controlled and protected environments, an increasing part is embedded in a more electronics-hostile environment. Automotive, Avionic, well-logging … circuits are required to perform accurately, reliably and predictable when subjected to wide range, high voltage supplies, to high temperatures and to powerful interferences.
These talks will focus on the high voltage and high temperature challenges and limitations of automotive circuits. The first part covers the high voltage aspects : requirements, technologies, devices and models, breakdown and high field limitations and reliability issues. The second part deals with high temperature : requirements, material limitations, device behaviour, leakage, temperature distribution and hot spots and reliability limitations.

ESD Protection in HV Design
Timothy Schmerbeck, IBM

This talk is a general treatment of the causes and prevention of integrated circuit ESD vulnerability including the various ESD models and standards, with testing & simulation methods; a comprehensive treatment of common ESD protection structures; and how to design to accommodate needed protection levels. The emphasis will be on extending ESD protection for higher voltage applications as well as automotive applications.

Environment Interferences
Herman Casier, Consultant

This talk will focus on EMC and power supply transients at chip and ECU level in the automotive environment. After a brief refresh of EMC, the difficulty to treat EMC in the IC design flow will be shown. Next, the Emission (EME) is treated : what happens, how to simulate and general techniques to lower EME. The Immunity (EMI) is the next topic. What happens, how to simulate and general design techniques to improve immunity are discussed. The last topic are the power supply transients which can generate large substrate currents.

Power Switchers, Gate Drivers and Protection
Bernhard Wicht, Reutlingen University

This talk covers the sizing of DMOS power switches, associated parasitics and isolation methods. The sizing has influence on switching behavior, losses and gate charge. The design of low-side and high-side gate drivers as well as of fast and robust levelshifters is also addressed. It includes optimization regarding delay, power dissipation and area. Finally, protection circuits and methods against overvoltage, overcurrent, short circuits, etc. will be discussed.

Linear Regulators and Charge Pumps
Bernhard Wicht, Reutlingen University

Linear regulators and charge pumps belong to the essential blocks in smart power ICs. Starting with the dropout specification, the most important DC and AC parameters for linear regulators will be discussed. The transfer function of the control loop will be derived and its influence on loop stabilization. The second part of the talk covers the design of charge pumps. The charge balance results in sizing rules for output voltage drop and ripple, mainly depending on load current, capacitor size and switching frequency.

Switched Mode Power Supplies
Bernhard Wicht, Reutlingen University

With the increasing need for efficient power supplies, switched mode power supplies are being widely used. They provide excellent power efficiency at the expense of increased complexity and noise. This talk gives a general introduction into circuit and system design for switched mode power supplies suitable for high voltage and automotive. A high level of integration can be achieved by increasing the switching frequency as it scales down passive components.

Circuit Design for EMC
Michiel Steyaert, KU Leuven

Introduction to EMC problems: EMI, EME, EMS, charge pumping. EMS design techniques on basic building blocks: principles, current mirror, input and output structures.

Functional Safety According to ISO26262 in IC Design
Dirk Hammerschmidt, Infineon Technologies

The permanent increase of safety relevant electronic functionality in cars has lead to a significant rise of our cars safety and reliability. However the overall probability of faults in those systems increases with their complexity and would lead to unintended risks, if their influence is not mitigated properly. The release of the automotive specific functional safety standard ISO26262 puts additional focus on the avoidance of system failures from unavoidable hardware. Required principles of safety design will be introduced in the course.

Automotive Sensors
Dirk Hammerschmidt, Infineon Technologies

Active and passive automotive systems heavily rely on information that is gathered by sensors that are distributed all over the vehicle. The lecture will provide an introduction automotive sensors starting from the automotive applications and the resulting requirements, over the magnetics and MEMS sensing technologies, the related frontend circuitry and signal processing steps up to the transmission of the measurement data via specific communication channels. Furthermore principles of selftest and selfcalibration will be introduced.

registration

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